Anzeige
HANNOVER MESSE 2018, 23. - 27. April

MSE

Logo MSE
Messestand
Halle 2, Stand A52
Hallenplan öffnen
Thema: Bayern Gemeinschaftsstand - Bayern Innovativ
Partner bei
Bayern Innovativ

Kontakt­daten

Micro Systems
Engineering
GmbH

Schlegelweg 17
95180 Berg
Deutschland
E-Mail senden
Fax: +49 9293 78 741

Ansprech­partner

Herr Nikolaus Petzold
Sales Manager
E-Mail senden

Fakten

Anzahl Mitarbeiter
251-500 (Stand: 2017)

Produkte

Protection / Encapsulation

Protection / Encapsulation. - Glob Top (Temp./UV-Curing) - Inline/Off-Line-Underfill (LTCC, PCB) - Junction Coating - Cover and Lid Soldering/Gluing -Transfermoldingweiterlesen

Attach Technologies

Gluing - Epoxy printing - Epoxy dispensing - Preforms Soldering - Solder printing - Solder dispensing ...weiterlesen

Wire Bonding Technologies

Ultrasonic - Al-thin wire bonding Standard, - Al-thick wire bonding Fine Pitch Power Devices Thermosonic - Au-thin wire bonding Standard, Wedge/Wedge - Au cold wire bonding Microwave, ...weiterlesen

Thick Film

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance. Standard Thick Film Ceramic substrate ...weiterlesen

Low Temperature Cofired Ceramics (LTCC)

LTCC is a multilayer ceramic technology and stands for Low Temperature Co-fired Ceramic, which low sintering temperature - around 900° C - allows the usage of noble high conductivity metals as silver and gold. Green sheets out of glass, alumina and organic binder are punched and the vias are filled with ...weiterlesen

Auf der Merkliste

0

Das Merken ist fehlgeschlagen, da ein Problem mit der Verbindung zum Server aufgetreten ist.