HANNOVER MESSE 2018, 23 - 27 April
Homepage>Conference program >DIN-Connect: funding program and innovation platform
tech transfer Forum

DIN-Connect: funding program and innovation platform

Location & Language

Hall 2, Stand C02



Event Details

Type of event



Research & Technology

Event series

tech transfer Forum

Event Host

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DIN initiated DIN-Connect, a program which aims at funding innovations, in cooperation with DKE. In DIN-Connect DIN and DKE aspire to financially support innovation projects with standardization potential. Whereas the first winning projects just have kicked off in January 2017, preparations for the next turn of DIN-Connect 2018 already have been started. As from 1st of June 2017 new ideas can be submitted via the DIN innovation platform. Potential projects can run up to 12 months and have to aim for the development of DIN SPEC (PAS) or VDE-specifications. Start-ups will be preferred. DIN and DKE strive for supporting ideas out of following fields: industry 4.0, smart mobility, secure digital identities, smart textiles, ageing societies and safety concepts for electrical safety.


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