Advertisement
HANNOVER MESSE 2018, 23 - 27 April
Exhibitor 2017

MSE

Logo MSE
Exhibition stand
Topic: German Pavilion - Bavaria Innovative
Co-exhibitor with
Bayern Innovativ

Company Data

Micro Systems
Engineering
GmbH

Schlegelweg 17
95180 Berg
Germany
Send E-mail
Fax: +49 9293 78 741

Contact(s)

Mr. Nikolaus Petzold
Sales Manager
Send E-mail

Facts

No. of employees
251-500 (Status: 2017)

Company profile

Founded in 1984 as a supplier of electronic modules for implantable pacemakers, MSE has been focusing on excellence ever since.

From the early days till now manufacture of electronic modules for implantable active devices at the highest quality level is the heart of our business.

And, MSE has always been convinced that all that knowledge, experience and dedication mandatory in medical device production should be available to customers of other industries as well who expect leading edge production technology.

MSE has a reputation for bridging sophisticated technological knowledge and high quality serial production needs.

Our mission is to support our customers as a partner from the concept phase through prototyping to volume production, from design support over quality management to procurement.

With some 190 skilled workers, technicians, engineers and scientists we have the critical mass in all that we do, still maintaining the efficiency and flexibility of a mid sized enterprise.

Company website

Products

Protection / Encapsulation

Protection / Encapsulation. - Glob Top (Temp./UV-Curing) - Inline/Off-Line-Underfill (LTCC, PCB) - Junction Coating - Cover and Lid Soldering/Gluing -Transfermoldingread more

Attach Technologies

Gluing - Epoxy printing - Epoxy dispensing - Preforms Soldering - Solder printing - Solder dispensing ...read more

Wire Bonding Technologies

Ultrasonic - Al-thin wire bonding Standard, - Al-thick wire bonding Fine Pitch Power Devices Thermosonic - Au-thin wire bonding Standard, Wedge/Wedge - Au cold wire bonding Microwave, ...read more

Thick Film

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance. Standard Thick Film Ceramic substrate ...read more

Low Temperature Cofired Ceramics (LTCC)

LTCC is a multilayer ceramic technology and stands for Low Temperature Co-fired Ceramic, which low sintering temperature - around 900° C - allows the usage of noble high conductivity metals as silver and gold. Green sheets out of glass, alumina and organic binder are punched and the vias are filled with ...read more

Stored items

0

Server communication error: Item could not be saved.