HANNOVER MESSE 2018, 23 - 27 April


Logo MSE
Exhibition stand
Hall 2, Stand A52
Topic: German Pavilion - Bavaria Innovative
Co-exhibitor with
Bayern Innovativ

Company Data

Micro Systems

Schlegelweg 17
95180 Berg
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Fax: +49 9293 78 741


Mr. Nikolaus Petzold
Sales Manager
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No. of employees
251-500 (Status: 2017)

Company profile

Founded in 1984 as a supplier of electronic modules for implantable pacemakers, MSE has been focusing on excellence ever since.

From the early days till now manufacture of electronic modules for implantable active devices at the highest quality level is the heart of our business.

And, MSE has always been convinced that all that knowledge, experience and dedication mandatory in medical device production should be available to customers of other industries as well who expect leading edge production technology.

MSE has a reputation for bridging sophisticated technological knowledge and high quality serial production needs.

Our mission is to support our customers as a partner from the concept phase through prototyping to volume production, from design support over quality management to procurement.

With some 190 skilled workers, technicians, engineers and scientists we have the critical mass in all that we do, still maintaining the efficiency and flexibility of a mid sized enterprise.

Company website


Protection / Encapsulation

Protection / Encapsulation. - Glob Top (Temp./UV-Curing) - Inline/Off-Line-Underfill (LTCC, PCB) - Junction Coating - Cover and Lid Soldering/Gluing -Transfermoldingread more

Attach Technologies

Gluing - Epoxy printing - Epoxy dispensing - Preforms Soldering - Solder printing - Solder dispensing more

Wire Bonding Technologies

Ultrasonic - Al-thin wire bonding Standard, - Al-thick wire bonding Fine Pitch Power Devices Thermosonic - Au-thin wire bonding Standard, Wedge/Wedge - Au cold wire bonding Microwave, more

Thick Film

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance. Standard Thick Film Ceramic substrate more

Low Temperature Cofired Ceramics (LTCC)

LTCC is a multilayer ceramic technology and stands for Low Temperature Co-fired Ceramic, which low sintering temperature - around 900° C - allows the usage of noble high conductivity metals as silver and gold. Green sheets out of glass, alumina and organic binder are punched and the vias are filled with more

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