HANNOVER MESSE 2018, 23 - 27 April
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Shenzhen Goldlink

Committed to the design of TIMs, diversified thermal solution

Logo Shenzhen Goldlink
Exhibition stand
(Main stand)
Hall 11, Stand F57
Thermal management for a multitude of industries including EV battery, UAV, computer, consumer electronics, optical, military and medical equipment.
Co-exhibitor with
CMEC International Exhibition

Company Data

Shenzhen Goldlink Tongda
Electronics Co. Ltd

6F, Rm 616, Huafeng Xi'an Com. Bldg.
Block45, Baoan
518100 Shenzhen
Send E-mail
Fax: +86 755 27579350


Mr. Lynn Gui
Send E-mail


Type of company

Year founded

No. of employees
11-50 (Status: 2017)

Annual turnover
between 1M and 10M USD (Status: 2017)

Committed to design of TIMs, business including Silicone Thermal Pad, Silicone free thermal pad, thermal putty gel, Thermal Tape, Thermal Interface Grease, Two-part dispensable thermal pad, Phase Change Materials, thermally conductive EMI absorber.

Company profile

Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.

Our business includes Silicone Thermal Pad, Silicone Rubber Pad, Silicone Putty Pad, Silicone Thermal Tape, Thermal Interface Grease, Two-part Thermal Interface Sealing Compound, Silicone Thermal Gel, Thermal Interface Phase Change Materials and Non-Silicone type products.

We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

Company website


Pioneer Thermal Solution

High performance, Low thermal impedanceread more

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