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HANNOVER MESSE 2018, 23 - 27 April
Exhibitor 2017

WELCON

Exhibition stand
Topic: Group Exhibit Hydrogen + Fuel Cells + Batteries
Co-exhibitor with
Takaishi Industry

Company Data

WELCON Inc.

15-1 Akihaku Yashiroda
Niigata 956-0013
Japan
Send E-mail
Fax: +81 250 381901

Company profile

WELCON Inc. is a comprehensive provider of design, modeling, prototyping, evaluation, and manufacturing services for complex components that simply cannot be made by machining process. Using diffusion bonding technology, WELCON works closely with its customers to optimize the design and fabrication of 3D hollow structure parts. Diffusion bonding opens up a whole new approach of the design and fabrication.

Products

Pre-cooler / inter cooler solutions

WEL-Therm ® is complex material which materialize both highly efficient thermal conductivity and low coefficient of thermal expansion. Low cost and stable product supply is possible since rare metal, such as tungsten and molybdenum, is not used.read more

High efficient micro channel heat sinks

Liquid-cooling heat sink is a heat sink using micro channels. If used as a Liquid-cooling heat sink, distinctive efficiency can be achieved. Touching surface has been enlarged greatly by making flows micro channels. A Liquid-cooling heat sink is excellent to draw heat away from material with high heating ...read more

High efficient micro channel heat exchan

High efficient micro channel heat exchanger Micro heat exchanger is a heat exchanger using micro channels. We produces heat exchangers with various size of flow channel in different material. Standard model is SUS316L type ranging from 3kW to 10kW type. It has been used Wasted heat recovery for plant, ...read more

Diffusion bonding based 3D components pr

Diffusion bonding based 3D components provider Diffusion bonding is a technology to bond materials together by applying heat and force to the materials, using diffusion of atoms. Without melting the materials it could be join together. Diffusion binding is technology to bond plane surface by layer ...read more

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