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HANNOVER MESSE 2018, 23 - 27 April
Homepage>Exhibitors & Products >3-D MID Surface Functionalization
R&D-Project

3-D MID Surface Functionalization

TU Chemnitz

Exhibitor details
Logo 3-D MID Surface Functionalization

Exhibition stand
Topic: R&D Collaboration Pavilion

Hall 2, Stand A38

Contact(s)
Ms. Agnieszka Kalinowska
Scientific Assistant
Send E-mail
Fax: +49 371 531 839544

Product description

3-D MID are thermoplastic parts with integrated circuit traces. They provide an enormous technical and economic potential. Key markets for the MID-Technology are automotive electronics, telecommunication and medical applications. The presented study shows an innovative method where the surface functionalization is integrated in the injection molding process without any commonly needed activation processes. This process can save costs and effort.

Development status
Under development

Market introduction
12.2016

Degree of documentation
Very well documented

Market orientation
Mass market

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