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HANNOVER MESSE 2018, 23 - 27 April
Homepage>Exhibitors & Products >3-D MID Surface Functionalization
R&D-Project

3-D MID Surface Functionalization

Logo TU Chemnitz

Exhibitor

TU Chemnitz

Exhibitor details
Exhibitor details
Logo 3-D MID Surface Functionalization
Development status
Under development
Market introduction
12.2016
Degree of documentation
Very well documented
Market orientation
Mass market

Product description

3-D MID are thermoplastic parts with integrated circuit traces. They provide an enormous technical and economic potential. Key markets for the MID-Technology are automotive electronics, telecommunication and medical applications. The presented study shows an innovative method where the surface functionalization is integrated in the injection molding process without any commonly needed activation processes. This process can save costs and effort.

Hall 2, Stand A38

R&D Collaboration Pavilion

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