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HANNOVER MESSE 2019, 01 - 05 April
Homepage>Exhibitors & Products >Electrochemical copper plating

Electrochemical copper plating

Logo Belarusian State Technological Univers.

Exhibitor

Belarusian State Technological Univers.

Exhibitor details
Exhibitor details
Logo Electrochemical copper plating

Product description

Application:

- providing adhesion strength to frictional compositions and general mechanical rubber goods;
- preventing from carburization in cementation;
- ensuring screwing ability in steel and cast-iron goods at higher temperatures;
- sublayering of multilayer electroplating

Description:

- Electrochemical copper plating is obtained from weak electrolyte which contains citrate ions as a complexing agent. The operating density of electrolysis current is 1.0-2.2 A/dm2 in the stationary mode, that of pulse current being up to 10 A/dm2. The current yield makes up not less than 96-96%.
- The developed technology enables making lustrous copper deposition directly onto steel and cast-iron surfaces without preliminary finishing. At the same time it ensures strong surface adhesion and prevents copper cementation on steel and cast iron.

Advantages:

- high deposition rates;
- high throwing power - 70-80%;
- no porosity with thickness being 3 um;
- environmental safety of the electrolyte as it contains no cyanides or ethylene diamine.

Hall 2, Stand C02/1

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