Applications for lead frame packages are to be found in areas where high electric currents are to be distributed on a confined space. Such current distributors are used in automobiles.
In most cases lead frames are dimensioned in such a way that a direct connection to a cable harness over multipole plug and socket connectors are being enabled. Discrete components like relays or fuses can be assembled by means of appropriate connectors. Lead frames are printed circuit boards, which are separated from a material strip using a stamping tool. Depending on the particular application, lead frames may be made of different materials. A decision regarding the material depends on the application. The delivery and further processing is carried out at the line or in sections.
In the field of SM-technology (SMT), the population with electronic components requires that the lead frames are tin-coated. For SMD-components of size 0603 or fine pitch elements, the lead frame may be designed with the smallest grid structures. Land widths or slot widths of 0.1 mm are possible. The advantage of lead frames is that three-dimensional structures and formations can be implemented. In view of sensor technology, it is possible to apply the most diverse components. Different component options are available from wire strain gauges (DMS) and Hall sensors to piezoceramics. The respective electronic circuit is adjusted to the sensor. It is possible to integrate a temperature relaxation. Sensitivity range and signal amplification can be configured or adjusted by means of programmable logic.