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HANNOVER MESSE 2018, 23 - 27 April

Lead Frames

Kleiner Stanztechnik

Exhibitor details
Logo Lead Frames

Exhibition stand
(Main stand)
Topic: German Pavilion - Baden-Wurttemberg International

Hall 27, Stand H75

Contact(s)
Mr. Torben Dierlamm
Sales
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Mr. Stefan Dreja
Sales
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Product description

Applications for lead frame packages are to be found in areas where high electric currents are to be distributed on a confined space. Such current distributors are used in automobiles.

In most cases lead frames are dimensioned in such a way that a direct connection to a cable harness over multipole plug and socket connectors are being enabled. Discrete components like relays or fuses can be assembled by means of appropriate connectors. Lead frames are printed circuit boards, which are separated from a material strip using a stamping tool. Depending on the particular application, lead frames may be made of different materials. A decision regarding the material depends on the application. The delivery and further processing is carried out at the line or in sections.



In the field of SM-technology (SMT), the population with electronic components requires that the lead frames are tin-coated. For SMD-components of size 0603 or fine pitch elements, the lead frame may be designed with the smallest grid structures. Land widths or slot widths of 0.1 mm are possible. The advantage of lead frames is that three-dimensional structures and formations can be implemented. In view of sensor technology, it is possible to apply the most diverse components. Different component options are available from wire strain gauges (DMS) and Hall sensors to piezoceramics. The respective electronic circuit is adjusted to the sensor. It is possible to integrate a temperature relaxation. Sensitivity range and signal amplification can be configured or adjusted by means of programmable logic.

All products offered by this exhibitor

Press-Fit Zones

The EloPin® is an elastic press-fit zone which adapts perfectly to conditions on a printed circuit board, creating an optimal electrical connection with a high level of mechanical stability, using low press-fit force while ensuring high retention force. The press-fit area of the EloPin® uses the proven ...read more

Patterns

With patterns everything becomes clearer. How does the material react when stamping? Which tool details have to be defined by us so the part is created reliably? Samples offer a great opportunity to gain more knowledge, haptically as well as optically. It is a standard requirement to carry out the whole ...read more

Wage labour - tool shop

In or out. Insourcing or outsourcing. You know this situation. Either there is nothing to do or everyone needs their orders at the same time. It is good to have a partner like KLEINER that's got your back and who carries your overload fast and uncomplicated and who fulfills it "just as good as if you ...read more

Micro stampings

Technology: bulk material Thickness: starting at 0.05 mm High precision KLEINER tools on Bruderer presses 25 - 30 tons pressing force Distribution: up to 1,000 strokes/minutes Branches: automotive, electric industry, telecommunication and medical technology, watch making industry Fields of application: ...read more

Assemblies / Stamping technology

Assembly manufacturing is a strategic redevelopment of KLEINER. It is based on the high level, which KLEINER has achieved in more than 20 years of stamping technology. Unlike other companies, we continue to consider stamping our core competency and cooperate with partners in terms of other production ...read more

Lead Frames

Applications for lead frame packages are to be found in areas where high electric currents are to be distributed on a confined space. Such current distributors are used in automobiles. In most cases lead frames are dimensioned in such a way that a direct connection to a cable harness over multipole ...read more

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