To meet the foreseeable rising demand for microcomponents, economically viable methods of production and capacities for medium to high outputs are required. Another important aspect is the broadest possible range of materials to be covered for a variety of applications of microsystems technology. One key technology meeting both requirements is injection molding. A distinction must be made between injection molding of polymers, on the one hand, and powder injection molding followed by removal of the polymer binder and sintering to metal or ceramic components, on the other hand. Translating conventional injection molding techniques into the special requirements of microsystems technology has taken, and still takes, sophisticated advanced developments in terms of process technology, simulation technology, tooling and machine technologies. Other special methods of injection molding are insert and two-component injection molding in which multifunctional components can be made by inserting a semi-finished product prior to injection molding or by injecting two different molding compounds during one cycle. One economically outstanding factor is the reduced expense of handling and assembly. Development work is being carried out to open up these techniques to components of microtechnology.