High-performance microchip development places emphasis on packaging of complex integrated semiconductor circuits, in particular as regards modules in the submillimeter wave range above 100 gigahertz. Scaling of electronic components with increasing frequency ensures a very high degree of miniaturization. Such modules are used in radar sensor technology and industrial automation, for example for high-precision distance measurement, in spectroscopy for material detection, and in medical engineering for contactless pulse and respiration measurement. So far, complex procedures have been required to assemble the respective semiconductor components, emitting elements (antennae), and elements for DC power supply. Together with Fraunhofer Institute for Applied Solid-state Physics (Fraunhofer Institut für Angewandte Festkörperphysik - IAF), researchers at KIT's Institut für Hochfrequenztechnik und Elektronik have developed a method for assembling the module circuits while at the same time providing signal connection. This method allows integration of antennae or waveguide transitions as well as of the entire DC power supply and further passive structures such as special converters or waveguides for high-frequency signals. Flip-chip assembly is by placing the chip with integrated semiconductor circuit with the active contact side face-down and connecting it directly with a carrier film via electrically conductive gold balls. The multi-layer film contains high-frequency conductive structures for electrically connecting the semiconductor component with the other high-frequency components. To remove heat losses, the semiconductor element is connected thermally with the free upper surface. Manufacturing is simplified by integrating different semiconductor components into one module. The modules can be designed more compactly and have a higher reliability due to the fact that they consist of fewer individual components and have a good heat removal.