advertisement
advertisement
HANNOVER MESSE 2019, 01 - 05 April
Homepage>Exhibitors & Products >Of plates and pastes

Of plates and pastes

Production method creates power electronics modules.

Logo Karlsruher Institut für Technologie

Exhibitor

Karlsruher Institut für Technologie

Exhibitor details
Exhibitor details
Logo Of plates and pastes

Product description

Power electronics modules are the key components of inverters, which see to the conversion and supply of electrical energy in wind power plants, machines and electrically-powered vehicles. Essentially, they consist of semiconductor components that have been fixed to a substrate. This substrate enables the components to be electrically connected and maintains a good thermic link with a cooling element. The standard method to produce substrate is direct copper bonding (DCB), in which conducting copper structures are applied to a ceramic plate on both sides. The circuit layout can be implemented by etching the copper. Copper thick-film substrates in which several layers of metal powder paste are printed onto the ceramic carrier represent an alternative to this. However, depending on the thickness of the coating, this requires several printing processes, which results in excessive material costs and an elaborate production effort. At the Institute for Data Processing and Electronics (IPE), scientists have developed an alternative production method in which the thick-film technique is combined with prefabricated conducting elements made of sheet copper to reproduce various conducting structures. First, a thin layer of copper paste is printed onto the ceramic substrate. Before this layer has dried, the copper platelets are placed onto the paste with the aid of a pick-and-place machine and then pressed against it. In this manner, copper is only applied where it is really needed. The subsequent drying and burning-in process creates a secure bonding of the ceramic, the paste and the plate. Unlike existing methods, the two copper components allow layers of different thicknesses to be applied to a single substrate with little effort. High-current areas can be placed next to delicate layouts at a low cost. The new procedure enables the integration of integrated circuits with very dense connecting pitches.

Product website

Hall 27, Stand K51

More products from Karlsruher Institut für Technologie

Show more

Stored items

0

Server communication error: Item could not be saved.