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HANNOVER MESSE 2018, 23 - 27 April

Thick Film

Logo Thick Film

Exhibition stand
Topic: German Pavilion - Bavaria Innovative

Product description

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance.
Standard Thick Film Ceramic substrate is particularly well suited for small geometry and high resistor value circuitry.

Product website

All products offered by this exhibitor

Protection / Encapsulation

Protection / Encapsulation. - Glob Top (Temp./UV-Curing) - Inline/Off-Line-Underfill (LTCC, PCB) - Junction Coating - Cover and Lid Soldering/Gluing -Transfermoldingread more

Attach Technologies

Gluing - Epoxy printing - Epoxy dispensing - Preforms Soldering - Solder printing - Solder dispensing ...read more

Wire Bonding Technologies

Ultrasonic - Al-thin wire bonding Standard, - Al-thick wire bonding Fine Pitch Power Devices Thermosonic - Au-thin wire bonding Standard, Wedge/Wedge - Au cold wire bonding Microwave, ...read more

Thick Film

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance. Standard Thick Film Ceramic substrate ...read more

Low Temperature Cofired Ceramics (LTCC)

LTCC is a multilayer ceramic technology and stands for Low Temperature Co-fired Ceramic, which low sintering temperature - around 900° C - allows the usage of noble high conductivity metals as silver and gold. Green sheets out of glass, alumina and organic binder are punched and the vias are filled with ...read more

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