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HANNOVER MESSE 2018, 23 - 27 April
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TU Berlin - Intellectual Property Center

Technische Universität Berlin

Exhibitor details
Logo TU Berlin - Intellectual Property Center

Exhibition stand
Topic: Innovationsmarkt Berlin-Brandenburg Pavilion

Hall 2, Stand B33

Product description

The Center for Intellectual Property is the central contact point at TU Berlin for all questions regarding technology and law. As a technology transfer office, we are the party to contact for the legal protection and the commercialization of research results and inventions.
Due to several national and international partners, technologies developed at the TU Berlin are already being used in some products and systems worldwide. Cooperations with the TU Berlin are possible at every stage - from the beginning of the research to the near-term development to the licensing of the patented technology. In doing so, the respective interests and requirements of the scientific and economic side are individually coordinated with each other.
At the Hannover Messe, we present all the inventions of the TU Berlin. This includes technologies from the clusters of machine and plant engineering, optics, information and communication technology as well as engineering. Special sensors for force and torque measurement, novel data storage methods, improved cooling systems as well as antenna technology for location and distance determination as well as innovative methods for video coding are some examples of our patented technologies. One particularly important feature is an e-mobility patent, which makes battery production more cost-efficient and allows a high degree of automation.
Moreover, we invite you to test one of our inventions at first hand: A mobile haptic interaction device allows you to experience large forces with high dynamics at low masses through its special 3-axis-kinematics - along with VR environment, this could be of great advantage e.g. in mounting simulation. Compared to current mobile haptic device this one has up to factor 100 higher forces, a up to 300 times higher working space volume and an up to 150 times higher stiffness.

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