HANNOVER MESSE 2020,
20 - 24 April
CiS Forschungsinstitut für Mikrosensorik
A new hybrid micro-assembly center expands the technological basis for the development of advanced solutions for the fully automated assembly of application-specific UV-LED modules in various series quantities and designs, whether as single LED light source or flood lamp.
The modular system concept allows the performance of the most important assembly and packaging steps in one device. Special functions for laser soldering, dispensing and jetting of solder pastes, pick & place of fragile components, highly precise and fast alignment of UV-LEDs, as well as innovate joining processes such as thermo-sonic bonding can be realized with this platform. The individual processes are qualified separately during the development and are later processed fully automatically. The so-called plug and play concept allows rapid switching between different process configurations and assembly techniques as well as the integration of new and in-house developed assembly units. In addition, due to the two-portal design, two technological steps (e.g. dispensing of solder paste and soldering of UV LEDs) can be carried out simultaneously, cutting the assembly time almost in half.
The requirements related to the mounting of UV LEDs are manifold, ranging from the assembly of various types of UV LEDs in very confined spaces to the development of high-performance flood lamps with extremely good heat dissipation to wafer-level-packaging, for example on multi-functional silicon carriers with integrated monitoring, temperature and protective diode function as well as integrated optics. Standard components for the control electronics can also be processed using conventional SMD technology. The prerequisite is a high degree of flexibility in the process sequence as well as in the periphery of the micro-assembly center.
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