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HANNOVER MESSE 2019, 01 - 05 April
Homepage>Exhibitors & Products >Assembly of Power Electronics

Assembly of Power Electronics

Novel Assembly Concept for Switching Power Electronics.

Logo Karlsruher Institut für Technologie

Exhibitor

Karlsruher Institut für Technologie

Exhibitor details
Exhibitor details
Logo Assembly of Power Electronics

Product description

Wherever electricity is produced, transported or used, power electronic components are applied. They are combined into modules, with each module accommodating several components, so-called power semiconductors. These power semiconductors are configured such that energy flow is controlled according to the power demand. For low-loss, power semiconductors are operated in switch mode. The higher the switching frequency, the smaller are the space needed and the weight of such systems. Such compact systems are beneficial in electric drives of electric cars and wind power plants. In order to reach high switching frequencies, however, an undesired property of power modules has to be minimized: the inductance. Inductance causes slower, high-loss switching processes as well as potential damage of power semiconductors right up to total system failures. Conventional power electronic modules have a layer structure: Onto a non-conductive carrier substrate, conductive structures are applied onto which power semiconductor chips are mounted. Modules are connected to external systems via bulky plug or screw contacts. This design produces undesired inductance and hardly any further electronic components can be integrated. Researchers of the KIT Institute of Data Processing and Electronics (IPE) developed a novel concept for the design of low-inductance modules. For this purpose, a plate-shaped connection element is applied vertically to the main substrate for connection of the power electronics with the mainframe circuitry. It accommodates both forward and return conductors and connects the components electrically as well as mechanically. The compact design reduces the space required onto the module substrate.

You can get an overview of this technology at KIT stand. Detailed information can be exchanged individually in contact with the responsible scientific employees of KIT after the industry fair.

Product website

Hall 27, Stand L51

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