HANNOVER MESSE 2019, 01 - 05 April
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DragonFly™ Pro System

Electrifying Additive Manufacturing

Logo Nano Dimension


Nano Dimension

Exhibitor details
Exhibitor details

Product description

The unique DragonFly™ Pro additive manufacturing solution system for precision 3D printed electronics allows designers to accelerate concept and design validation and additively produce electrical circuits and antennas, keeping the process securely in-house and IP secure.
Traditional manufacturing for printed circuit boards, antennas, sensors and other electronic components is typically a lengthy process that involves working with off-site prototyping houses. Nano Dimension’s DragonFly Pro simplifies and speeds the process by building electronic elements through fully additive manufacturing, enabling designers to move rapidly from concept and design validation to the production of precision electronic components, while keeping the entire process securely in-house. Printing prototypes and customer print jobs in-house shortens design and test cycles from months or weeks to just days or hours.
The DragonFly Pro system overcomes many of the complexities and bottlenecks inherent in outsourced traditional prototyping and custom manufacturing, enabling in-house agility. The time and cost-effective 3D printing process enables innovation, printing individual sections of a PCB design, creating vias and through holes with no drilling or plating and saving space, weight and cost with complex geometric designs and new functions.
The DragonFly Pro is an all-in-one multi-material precision 3D electronics printer that brings together extremely precise inkjet deposition, a dedicated conductive nanoparticle silver ink printed simultaneously with a proprietary dielectric ink using novel software. Multi-material additive manufacturing for printed electronics is game-changing, allowing designers and engineers to print polymers and metals together to create a functional part. This revolutionary approach offers the potential for electronics to be more compact, denser and non-planarwith features like non-vertical vias, embedded components, passives and more.

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Hall 6, Stand H03

(Main stand)

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