HANNOVER MESSE 2019,
01 - 05 April
CiS Forschungsinstitut für Mikrosensorik
With stacked silicon photodiodes and refined optical thin film filters, spectrally sensitive detectors can be developed that can replace conventional, expensive spectrometers needed for special applications. A further feature of such spectral sensors is the elimination of measurement errors caused by undesirable polarization of the radiating source when fiber-optical sensors are used.
The MEMS technologies available and refined at CiS Research Institute were the basis for the development of a new generation of spectral sensors consisting of two detector chips stacked on top of another, each covering a specific spectral range. The upper diode is only 50 µm thin.
The compact assembly of the detector chips including filters, beam shaping elements, fiber coupler as well as electronics and housing allows a minimum sensor size just slightly larger than an ordinary APC connector. The opto-electronic converter is also available as an SMD component. The contacts are located on the back of the chip and enable the undisturbed incidence of light on the detector.
The new solution concept targets applications with a small wavelength range to be monitored. Narrow-band filters provide picometer accuracy when detecting the wavelength shifts. In addition, vibrations up to 1 MHz are measurable time-resolved with low noise.
Based on the developed micro-technologies and the proven system design a variety of customized sensor solutions can be implemented, for example for the monitoring of bridges, wind turbines and aircraft wing units or for the measurement of the surface plasmon resonance in biotechnology or pharmacy.
The research and development work in the project 3D-Spek-Sens was funded by the German Federal Ministry of Economics and Energy (Funding Code: MF130140).
German Pavilion - Thuringia
A new hybrid micro-assembly center expands the technological basis for the development of advanced solutions for the fully automated assembly of application-specific ...
The outstanding long-term stability, the high reliability and measuring accuracy as well as the chemical resistance of the media-contacting surfaces are the hallmarks ...
CiS Research Institute is currently developing a new silicon-based MEMS sensor to verify safety-related screw connections. Such special screws are used in mechanical ...
CiS Research Institute has expanded its opto-electronic skills to be able to develop multispectral UV light sources for fluorescence or absorbance measurements. ...
The CiS Research Institute has developed a tiny microchip for the determination of the direction of incident light. The small design and the easy integration as ...