HANNOVER MESSE 2019, 01 - 05 April
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Heat Shrink Solderable Butts, IP68

Logo Heat Shrink Solderable Butts, IP68

Product description

Material: heat shrinkable polyolefin with integrated adhesive ring, lead-free tin
Solder melting temperature: 138°C
Working temperature: -55-+125°C
Shrinking temperature: >200°C
Dielectric strength: 2kV
IP rating: IP68
Standard: CE
Feature: water-tight wire connector

Product website

Hall 13, Stand A57

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