HANNOVER MESSE 2019, 01 - 05 April
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Intel® Stratix® 10 FPGA

Product description

Heterogeneous 3D System-in-Package (SiP) integration
Highest memory bandwidth with HBM2 DRAM integrated in-package
Dual-mode transceiver with 58 Gbps PAM-4 and 30 Gbps NRZ

Product website

Hall 6, Stand G30

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