HANNOVER MESSE 2019, 01 - 05 April
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Laser processing

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Open R&D Lithuania

Exhibitor details
Exhibitor details

Product description

1. Laser Beam Interference Ablation below the diffraction limit, parallel processing of periodic structures;
2. Laser Direct Writing for thin-film structuring, selective and localized modifications of surface;
3. Ultrashort pulse Laser Ablation for 3D microfabrication of micromoulds, microfluidic channels;
4. Deep 3D laser engraving technology;
5. Laser ablation technology for the fabrication of THz optical components;
6. Precision processing of glass by laser;
7. Efficient dicing of sapphire wafers;

Product website

Hall 2, Stand A27

(Main stand)

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