HANNOVER MESSE 2019,
01 - 05 April
ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES's innovative microfabrication process for silicon capacitive sensors.
The capacitive pressure sensor dies integrated into the medium isolated pressure systems provide state-of-the-art accuracy and resolution, excellent long-term stability combined with very good repeatability and hysteresis. The total overall error including thermal offsets is lower than ±0.25% FS.
The ESCP-MIS1 Series is a family of pressure sensors in the standard Ø19 stainless steel 316L capsule. In this type of sensors, the pressure is hydraulicaly transferred to the hermetically sealed sensing element through the Silicon Oil used that fills the cavity between the sensing element and the stainless-steel diaphragm. The pressure capsule interface is either I2C or analog. The sensors are provided calibrated and compensated at various temperature and pressure ranges from 1 bara to 400 bara. Custom materials like Hastelloy or Titanium are available upon request.
Pressure Type: Absolute
Pressure Range: Up to 400bar
Power Supply: +3.3V
Current Consumption @ full operation: Total Error: Operating Temperature: -20C … +85C
Compensation Temperature: 0C … +60C , -20C … +85C
Digital Output: Calibrated Pressure & Temperature
Analog Output: Calibrated Pressure
Output: I2C, Analog, PWM
Overpressure Tolerance: Up to 100x
Media Compatibility: Gases, Liquids
Material Options: SS 316 L, Hastelloy, Titanium
AMA Center for Sensor, Measuring and Testing Technologies - Meeting Point Sensorics
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