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HANNOVER MESSE 2020, 20 - 24 April
Homepage>Exhibitors & Products >Of plates and pastes

Of plates and pastes

New production method for thick-film substrates.

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Karlsruher Institut für Technologie

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Exhibitor details
Logo Of plates and pastes

Product description

Power electronics modules are the key components of inverters, which see to the conversion and supply of electrical energy in wind power plants, machines and electrically-powered vehicles. Essentially, they consist of semiconductor components that have been fixed to a substrate. This substrate enables the components to be electrically connected and maintains a good thermic link with a cooling element. At the Institute for Data Processing and Electronics (IPE), scientists have developed an alternative production method in which the thick-film technique is combined with prefabricated conducting elements made of sheet copper to reproduce various conducting structures. First, a thin layer of copper paste is printed onto the ceramic substrate. Before this layer has dried, the copper platelets are placed onto the paste with the aid of a pick-and-place machine and then pressed against it. In this manner, copper is only applied where it is really needed. The subsequent drying and burning-in process creates a secure bonding of the ceramic, the paste and the plate. Unlike existing methods, the two copper components allow layers of different thicknesses to be applied to a single substrate with little effort. High-current areas can be placed next to delicate layouts at a low cost. The new procedure enables the integration of integrated circuits with very dense connecting pitches.

You can get an overview of this technology at KIT stand. Detailed information can be exchanged individually in contact with the responsible scientific employees of KIT after the industry fair.

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