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HANNOVER MESSE 2020, 20 - 24 April
Homepage>Exhibitors & Products >Plasma Enhanced Chemical VaporDeposition

Plasma Enhanced Chemical VaporDeposition

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Exhibitor

AGC Plasma Technology Solutions

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Exhibitor details

Product description

PECVD is achieved by introducing reactive gases between parallel electrodes creating the plasma. This low temperature process can be used to deposit silicon oxide based layers for anti-reflective properties or as a barrier layer (anti-corrosion). Using alternative pre-cursors, PE CVD also allows for the hydrophobic or hydrophilic functionalisation of surfaces. High dynamic deposition rates can be reached with the technology developed by AGC Plasma Technology Solutions.

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