HANNOVER MESSE 2019,
01 - 05 April
AGC Plasma Technology Solutions
PECVD is achieved by introducing reactive gases between parallel electrodes creating the plasma. This low temperature process can be used to deposit silicon oxide based layers for anti-reflective properties or as a barrier layer (anti-corrosion). Using alternative pre-cursors, PE CVD also allows for the hydrophobic or hydrophilic functionalisation of surfaces. High dynamic deposition rates can be reached with the technology developed by AGC Plasma Technology Solutions.
Plasma Enhanced CVD
Magnetron sputtering is a well established PVD technology allowing for large area coating. AGC has abundant experience with this technology for the coating of low ...
Ion implantation equipment consists of an ion source, where ions of the desired element are produced and accelerated and are subsequently bombarding the substrate. ...