HANNOVER MESSE 2019, 01 - 05 April
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Semiconductor plating

Logo KIYOKAWA Plating Industry


KIYOKAWA Plating Industry

Exhibitor details
Exhibitor details

Product description

Electrolytic plating
Consistent support from patterning to plating
Also supports trial production from 1 piece
Wafer size can accommodate 4 inches to 12 inches
Electrolytic Ni Au Cu SnAg can be used
Electroless plating
We can support tens of thousands of sheets per month for wafers of 8 inches or less
Mass production line for electroless Ni Au for aluminum electrodes
For other specifications, consultation is required

Product website

Hall 3, Stand M32

Japanese Pavilion

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