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HANNOVER MESSE 2020, 20 - 24 April
Homepage>Exhibitors & Products >Semiconductor plating
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Semiconductor plating

Logo KIYOKAWA Plating Industry

Exhibitor

KIYOKAWA Plating Industry

Exhibitor details
Exhibitor details
Logo Semiconductor plating

Product description

Electrolytic plating
Consistent support from patterning to plating
Also supports trial production from 1 piece
Wafer size can accommodate 4 inches to 12 inches
Electrolytic Ni Au Cu SnAg can be used
Electroless plating
We can support tens of thousands of sheets per month for wafers of 8 inches or less
Mass production line for electroless Ni Au for aluminum electrodes
For other specifications, consultation is required

Product website

Hall 3, Stand M32

Japanese Pavilion

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