HANNOVER MESSE 2019, 01 - 05 April


Design reliable semiconductors chips with production-proven solutions

Logo ANSYS Germany


ANSYS Germany

Exhibitor details
Exhibitor details
Logo Semiconductors

Product description

Increasing demand for smart electronic devices is driving integration and further miniaturization of integrated circuit (IC) technology. Interacting physics arising from shrinking geometries, especially in FinFETs, stacked-die and emerging 3D-IC architectures, result in power integrity and reliability-related design challenges. By simulating electromigration, thermal effects and electrostatic discharge phenomena, you can verify the power noise integrity and reliability of the most complex ICs. ANSYS simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC sign-off.

Product website

Hall 6, Stand H18

(Main stand)

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