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Shielding on plastic parts

Chemical metallization on plastic parts for EMI-RFI shielding

Product description

This process allows to chemically deposition of thin metal layers as copper, nickel, tin on housing and plastic cases, even selectively (only internally or in defined parts of the product) to ensure shielding from electromagnetic interference. Intended primarily for electronics and industrial automation, it is applied in all sectors where there are devices that require interference protection.

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