Anzeige
Anzeige
HANNOVER MESSE 2020, 20. - 24. April
Startseite>Aussteller- & Produktsuche >Circuit traces fabrication on dielectric

Circuit traces fabrication on dielectric

Logo Open R&D Lithuania

Aussteller

Open R&D Lithuania

Zur Ausstellerseite
Zur Ausstellerseite

Produktbeschreibung

Fabrication of circuit traces is the most challenging task in Moulded interconnect devices (MID) production, being both technically difficult to achieve and difficult to make cost effectively. The Selective Surface Activation Induced by Laser (SSAIL) is a new technology for writing electronic circuits directly onto dielectric material by modifying surface properties with a laser has been developed in the Center for Physical Sciences and technology. Lasers can write the circuits directly by modifying the surface of polymers followed by an electroless metal plating. SSAIL is a three-step process: the first is surface modification by laser; second is chemical activation of modified areas; and the last step is metal deposition by electroless plating. The new technology offers laser writing speeds of up to 4m/s, and spatial plating pitch is kept narrow at 25µm. This new technique for selective surface plating enables to use standard plastics without any special additives. While in analogue industrial technology "Laser Direct Structuring (LDS)" special additives mixed in whole volume of polymeric part are used. The additives increase the prices of the raw plastic material to 3-5 times. Thus, new SSAIL technology enables to reduce the processing cost at least 3 times comparing with current technology used in industry. Moreover SSAIL is capable metalize not only polymers but also a glass.

Weitere Produkte von Open R&D Lithuania

Mehr anzeigen

Auf der Merkliste

0

Anzeige
Das Merken ist fehlgeschlagen, da ein Problem mit der Verbindung zum Server aufgetreten ist.