Bimetal Plates- Bimetallic Sheets Cu-Al / CUPAL (Clad Metal Technology)
Elexo Cu-Al bimetallic plates are designed to provide a reliable and electrically stable interface between copper and aluminium conductors, preventing galvanic corrosion.
Direct contact between copper and aluminium, especially in the presence of humidity, creates a galvanic cell effect that deteriorates the less noble metal and worsens electrical performance.
The interposition of a Cu-Al bimetallic element eliminates this risk.
Our plates are manufactured using a rolling process with atomic diffusion bonding, molecularly binding the two metals without adhesives or chemical bonding agents.
Key Features
Clad metal structure Cu-ETP C1100 / Al 1050
70/30 material ratio (Al/Cu)
Standard thickness 1 mm (0.30 mm Cu / 0.70 mm Al)
High electrical conductivity
Good thermal resistance
No galvanic corrosion
Excellent bending formability
Available drilled or undrilled
Standard sheet size 2000 x 500 mm
Special dimensions available on request
Applications
Copper to aluminium busbar connections
Low and medium voltage switchgear
Electrical distribution systems
Energy and industrial infrastructures
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Deutsche Messe AG
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