Wafer handling for sophisticated system concepts
HIWIN, specialist for standard and customized drive solutions, is expanding its product portfolio with the new Wafer Aligner HPA, the company's first proprietary standard motion solution for wafer handling in semiconductor manufacturing.7 Feb 2024
Whether in the standard, warpage or edge contact process - the new Wafer Aligner HPA from HIWIN reliably aligns a wide range of wafers with diameters from two inches up to twelve inches. The Offenburg-based specialist for standard and customized drive solutions is thus expanding its product portfolio with its first standard motion solution for wafer handling in semiconductor production.
Equipped with a high-quality laser sensor, the Wafer Aligner supports the alignment of transparent, translucent and opaque wafers. Within a few seconds, three moving HIWIN axes with spindle drive work for wafer centering and angular alignment with a precision of ±0.1 millimetres and an angular accuracy of ±0.2 degrees. Depending on the aligner model, an X-Y unit or an X-Z unit is used for this purpose. With its all-in-one design, the HPA series is extremely compact and is therefore also suitable for integration into sophisticated system concepts. Thanks to its ISO certification (ISO 14644-1), the wafer aligner of the HPA series is also suitable for cleanroom class 3 and therefore ideal for use in the semiconductor industry. In addition, the motion technology specialist aims to score points with extremely short delivery times when providing the new wafer aligners.
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