Whether in the standard, warpage or edge contact process - the new Wafer Aligner HPA from HIWIN reliably aligns a wide range of wafers with diameters from two inches up to twelve inches. The Offenburg-based specialist for standard and customized drive solutions is thus expanding its product portfolio with its first standard motion solution for wafer handling in semiconductor production.

Equipped with a high-quality laser sensor, the Wafer Aligner supports the alignment of transparent, translucent and opaque wafers. Within a few seconds, three moving HIWIN axes with spindle drive work for wafer centering and angular alignment with a precision of ±0.1 millimetres and an angular accuracy of ±0.2 degrees. Depending on the aligner model, an X-Y unit or an X-Z unit is used for this purpose. With its all-in-one design, the HPA series is extremely compact and is therefore also suitable for integration into sophisticated system concepts. Thanks to its ISO certification (ISO 14644-1), the wafer aligner of the HPA series is also suitable for cleanroom class 3 and therefore ideal for use in the semiconductor industry. In addition, the motion technology specialist aims to score points with extremely short delivery times when providing the new wafer aligners.

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